With Aeroflex / KDI's new surface mount breakthrough, your production
schedule will fly!

Aeroflex / KDI-Integrated's Surfpac process is the fastest solution for your microwave and RF products to reach their target.

Prepare for takeoff...because now the sky's the limit for your RF and Microwave product lanuches. The new Aeroflex / KDI-Integrated Surfpac process shatters speed records throughout the hybrid circuit manufacturing and testing process to help you bring new products to market faster.

Surfpac takes surface mount packaging to new heights by using one ceramic substrate for both the circuit and hybrid package. And its low-cost alumina and thick film process eliminates the need for component materials like expensive gold-plated Kovar and glass to metal seals. This adds up to cost savings of 20:1 compared to the traditional hybrid-header substrate!

With this unique Surfpac process, we can make a multicircuit array on a single ceramic substrate, allowing us to produce up to 50 units simultaneously. This also ensures unit-to-unit consistency and quality for switches, attenuators, amplifiers, phase shifters and other components and subassemblies. All in any custome design you desire.

Plus, Surfpac lets you design the shortest possible physical length of both the ground and the active RF center conductor to the host mirostrip circuit. So you acn achieve high-flying microwave frequency performance (at least 6 GHz)

Ready to soar with speed, flexibillity and consistency of Surfpac? Email or send us your application or diagram and Aeroflex / KDI-Integrated will show you how.

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